Tin Whisker Testing
Tin Whiskers and Zinc Whiskers are tiny metallic crystalline growths believed caused by stress at the molecular level. Phenomena within the Tin or Zinc plating on many common metal components causes the molecules to align in such a way to produce tiny growths, or whiskers, on the surface. These fuzz-like pure metal growths can easily break off, become airborne, and enter sensitive electronic systems such as computers, servers, and telephone systems.
The metallic whiskers can cause electronic failures. From fighter jets to missiles and nuclear plants to commercial satellites, reports of malfunctioning electronics caused by Tin Whiskers are well-publicized.
- Labeled Sample Container(s)
- Instructions for Collecting a Sample
- A Record Sheet
- Instructions for Mailing Your Sample Back to Data Clean for Analysis
- Analysis of Each Sample
Before purchasing, it is recommended that you consult
with a Data Clean Representative for professional guidance.
The analysis utilizes Scanning Electron Microscopy (SEM) and Energy Dispersive Radiation to review both the geometry and elemental makeup of the sample. The analysis is able to distinguish between simple tin particles, common to almost all tin plated materials, and the dangerous tin whiskers.
Tin is a good conductor of electricity and is commonly used to plate the leads of electronic components and wires. If whiskers come to rest on exposed tin plated circuitry, short circuits and failures are likely.
Although the exact cause of whisker growth remains a mystery, there are various metallurgical methods used to attenuate growth. The electronics industry has historically used a mixture of tin and lead to plate electronic leads to make the leads more solderable and to prevent Tin Whisker growth. Recent lead-free initiatives (RoHS) in the European market and the subsequent return to pure tin plating in electronics are leaving many with questions as to whether their products are growing whiskers.
Testing is intended to confirm the presence of Tin Whiskers at the time and location a sample is collected. Whiskers could be growing on other components, not tested. And an object that shows no signs of Tin Whiskers could grow whiskers later.
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