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Tin Whisker TestingTin Whiskers and Zinc Whiskers are tiny metallic crystalline growths believed caused by stress at the molecular level. Phenomena within the Tin or Zinc plating on many common metal components causes the molecules to align in such a way to produce tiny growths, or whiskers, on the surface. These fuzz-like pure metal growths can easily break off, become airborne, and enter sensitive electronic systems such as computers, servers, and telephone systems.The metallic whiskers can cause electronic failures. From fighter jets to missiles and nuclear plants to commercial satellites, reports of malfunctioning electronics caused by Tin Whiskers are well-publicized. Data Clean Canada's Tin Whisker Test Kit includes:
![]() Before purchasing, it is recommended that you consult with a Data Clean Canada Representative for professional guidance. The analysis utilizes Scanning Electron Microscopy (SEM) and Energy Dispersive Radiation to review both the geometry and elemental makeup of the sample. The analysis is able to distinguish between simple tin particles, common to almost all tin plated materials, and the dangerous tin whiskers. Tin is a good conductor of electricity and is commonly used to plate the leads of electronic components and wires. If whiskers come to rest on exposed tin plated circuitry, short circuits and failures are likely. Testing is intended to confirm the presence of Tin Whiskers at the time and location a sample is collected. Whiskers could be growing on other components, not tested. And an object that shows no signs of Tin Whiskers could grow whiskers later. You may also be interested in other related Data Clean Canada Services: Please contact your local Data Clean Canada account manager for more information. |
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