>>Cooling Solutions → KoldLok Raised Floor Grommets → KoldLok Extended 3" - Model #10012 → Product Details

Extended Brush - Models #10012, #10013

Applications
Installation in new or existing raised floor tiles, designed to fill long narrow, above floor, perimeter cutouts.

Specifications
Grommet is inherently self-sealing using a multi-layer, overlapping, and interwoven, bypass airflow closure system consisting of:

Koldlok No. 10012 - 3"/76 mm Extended:

• Upper array of 0.010" diameter filaments
• Lower array of 0.020" diameter filaments
• Approximately 34,000 filaments
• Grommet usable cable opening size: 22" x 2 1/2"
• Grommet total cable opening size: 22" x 4 "

Grommet filaments are premium grade Nylon 6 ensuring bristle flexibility, compliance, and self-sealing recovery. Filaments are conductive with static dissipation properties.





Koldlok No. 10013 - 6"/152 mm Extended:

• Upper array of 0.020" diameter filaments
• Lower array of 0.036" diameter filaments
• Approximately 10,000 filaments
• Grommet usable cable opening size: 22" x 5 1/2"
• Grommet total cable opening size: 22" x 7 "

Grommet and filaments safely bleed off any static build up on cables passing through the cable opening caused by high velocity airflow (triboelectric effect). Grommet is an integral part of the raised floor¹s static dissipation system providing 1 GigaOhm of resistance.

Grommet shall achieve 100% bypass airflow sealing in areas undisturbed by cable penetrations at static pressures up to 0.010 inches of water column. When penetrated by four 1/2" cables, sealing is 100% effective at the static pressure required to cool up to 3 kW/cabinet with a 95% sealing effectiveness at a static pressure of 0.50".

Grommet ships with custom adhesive mounting kit consisting of:

• Four 3M™ 4300 series single-coated, double-sided pressure-sensitive acrylic adhesive foam mounting tapes
• Eight 2.5mm Youngboard-C, conductive grade, cross linked polyethylene foam buttons for ESD dissapation

Grommet is a heavy duty, 6030 aluminum alloy, anodized black with two each 18 gauge cold rolled steel end caps. End caps are black ESD powder coated to ensure static dissapation.

Grommet metal components are anodized to resist corrosion caused by high humidity.

KoldLok is a permanent airflow sealing solution which will accept perpetual cabling¹ changes without requiring technician training, policing, or labour to cut, scribe, re-install, reposition, or modify any part of the grommet.

KoldLok is the best² low cost solution for achieving the hardware air intake temperature and humidity conditions required for maximum reliability and performance by computer and communication manufacturers.

The KoldLok system of overlapping, offset, multi-layer, interwoven bypass airflow closures utilizing KoldFilaments™ guarantees sealing effectiveness. (U.S. Patent No. 6,632,999.)

KoldLok avoids unnecessary investments in additional cooling capacity* by reducing bypass
airflow which increases both the effectiveness and usable capacity of existing cooling equipment.

KoldLok's 55 - 120 (3" & 6" units) square inch usable cable area is sufficient to accommodate virtually all cabling requirements (typical cable fill area is less than 5 square inches, after plug has passed through).

KoldLok addresses oversized tile cutouts and raised-floor perimeter openings.

It is estimated that, on average, 25% of all raised floor openings are re-cabled quarterly.

Koldlok products are compliant with Directive 2002/95/EC of the European Parliament and the Council of the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS).

²Filaments are premium grade Nylon 6. Filaments made of styrene, ABS or polypropolene fall below KoldLok product standards.

*For a typical 10,000ft2 computer room with 170 cable openings, preventing the 49,000 cubic feet per minute bypass airflow loss through unsealed cable cutouts is equivalent to recovering the output from five or more 20-Ton cooling units.

Background
ELIMINATE BYPASS AIRFLOW
Unsealed cable openings allow 63% or more of bypass air losses in a typical computer room. Excessive bypass airflow will reduce underfloor static pressure to as low as 0.01" of water column. This is much lower than the 0.025" required for cooling high heat densities (> 1 kW/rack or cabinet). Unmanaged bypass air results in vertical and zone hot spots and introduces significant cooling inefficiencies.

A CLEAR SOLUTION
The KoldLok Extended Raised-Floor Grommet automatically reseals raised-floor openings, permanently solving bypass airflow problems.